HEAT SINK SPECIFICATIONS
* 6063-T5 AL MATERIAL HEAT SINK
* BLUE ANODIZE
* HIGH CONDUCTIVTY THERMAL PAD
* CROSS CUTTING
* Application for the VGA DDR memory Chip and DDR memory module
HEAT SPREADER SPECIFICATIONS
* AL MATERIAL HEAT SPREADER
* BLUE ANODIZED
* HIGH CONDUCTIVTY THERMAL PAD
* SPRING CLIP EASY TO INSTALLED
* PATENT PENDIN